Components

Welcome to Electronic Design's destination for components technology trends, products, industry news, new applications, articles and commentary from our contributing technical experts and the community.
Saras Micro Devices
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STILE is a substrate-embedded, passive module designed by Saras Micro Devices to support the growing number of power rails in high-performance SoCs.
ID 26521963 © Luchschen - Dreamstime.com
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TeraSignal's TS9802 Intelligent TIA incorporates diagnostics without a DSP.
75868080 © Vladimir Timofeev | Dreamstime.com
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By upgrading to the 3-nm process, Marvell is positioning the new Ara DSP to be a key building block of 1.6-Tb/s optical modules in the data center.
Molex
Molex VersaBeam
Molex's VersaBeam EBO Interconnect delivers low-loss, high-density fiber connections.
Inventive Resources
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The Enclosure Protector Attachment (EPA) from Inventive Resources balances internal and external air pressure to prevent contaminants from leaking into the enclosure.
Microchip Technology
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Surface-acoustic-wave technology yields impressive VCSO performance across multiple parameters, particularly regarding phase-noise mitigation.
ID 217230663 © Christian Offenberg - Dreamstime.com | electronica.de
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Check out our coverage of technology and products at electronica 2024.
Bourns
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Bourns’ latest series of low-profile shielded power inductors feature flat wire windings that deliver improved efficiency and a smaller form factor.
Pickering Electronics
Pickering’s Series 125 is the industry’s smallest DPST reed relay.
According to Pickering, its latest Series 125 is the industry’s tiniest DPST reed relay, switching up to 1 A, 20 W in a 5- x 5-mm pitch.