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MediaTek’s Genio family expands with NPU-enhanced chips that can handle generative AI.
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Inside Electronics
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Software Guided Intelligence
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Check out the breaking news, videos, and podcasts at this year's Embedded World conference.
March 10, 2026
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Check out the latest stories, videos, and podcasts from the week of Mar. 9, 2026.
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Stay on top of the technologies and trends in focus at APEC 2026 and hear from industry insiders on the state of the power electronics industry.
March 9, 2026
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Software-defined vehicles (SDVs) are built around real-time networking.
March 3, 2026

Learning Resources

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Discover how Air Source Heat Pumps are transforming HVAC design. This application brief highlights market opportunities, innovative solutions, and advanced technologies that accelerate...
March 5, 2026
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Uncover the critical insights into Air Source Heat Pumps in our latest whitepaper. It explores market dynamics, technology integration, and the challenges ahead, providing a roadmap...
March 5, 2026
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Geopolitical shocks, shifting trade alliances and volatile tariffs are reshaping global supply chains. Join our webinar to learn how leaders are redesigning networks, diversifying...
March 31, 2026
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Sponsored by Texas Instruments: Wide-bandgap materials and advanced embedded processing are being leveraged to enhance the efficiency, power density, and reliability in renewable...
Feb. 27, 2026

Featured Media

Examining a Physical AI Chiplet Platform
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Mick Posner highlights Cadence’s chiplet platform to support physical AI development.
March 9, 2026
Chiplets Summit Award Session
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A rundown of the award winners at Chiplet Summit 2026.
March 7, 2026
Vertical Power: Tackling AI’s Power Demands from Beneath the Board
Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath server boards and AI accelerator cards.
March 6, 2026
Women in Chiplets Summit Session
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A panel of leading women in semiconductors at the 2026 Chiplet Summit discuss AI’s impact on engineering careers, mentoring future generations, and gender dynamics in technical...
March 6, 2026

Inside Electronics Podcast

Technology Advancements

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Using LnFP technology as an active material, OMI said it has developed a rapid ion transport cathode designed to handle charging at a 20C rate.
March 5, 2026
Driving Innovation in 3d IC Chiplet Summit
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Find out about design trends, challenges, and solutions around 3D ICs.
March 4, 2026
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Inside Electronics
Find out how to do AI processing of multiple video streams locally.
March 3, 2026
The Ohio State University
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There may be a fungus on your future bill of materials if mushroom-based memristors become a viable memory element.
March 2, 2026

Products and Solutions

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A hybrid DC-DC converter topology boosts efficiency by combining a buck regulator and a charge pump. Is it the future of intermediate bus conversion?
March 9, 2026
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TI’s latest iso-amps are specifically designed for interfacing with current-sensing resistors.
March 6, 2026
Pickering
Pickering Launches Test System Architect to Streamline Signal Path Design and Deployment
Pickering's toolset accelerates design time, eliminates errors, and simplifies documentation across the test lifecycle.
March 5, 2026
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The magnetic current sensor from Allegro Microsystems is intended for high-voltage power converters prevalent in EVs and beyond.
March 3, 2026

Industry Insights

Cabe Atwell 2026
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In celebration of International Women's Day, I did a special drawing to capture the event.
March 6, 2026
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WCET analysis is essential for proving multicore real-time systems meet safety-critical deadlines under all operating conditions.
March 5, 2026
Georgia Institute of Technology
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Following a strategic approach to cooling, power delivery and rack-level integration will help data centers boost AI compute density.
March 4, 2026
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More engineers are turning to reinforcement learning to incorporate adaptive and self-tuning control into industrial systems. It aims to strike a balance between traditional process...
March 4, 2026