Top Stories of the Week: Nov. 3-Nov. 7, 2025

Check out the latest stories, videos, and podcasts from the week of November 3, 2025.
Nov. 4, 2025
2 min read

Welcome to Electronic Design's weekly publication wher you can find the latest articles vidoes and podcasts. Keep checking back as more content is added every day during the week. You can sign up for our daily newsletter to see the latest articles as they're posted. Check out the latest newsletters. You can also check out archived versions of Top Stories of the Week

Featured Content

THUNK
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Andy surveys various schemes for installing traction drives in ICE conversions and gets a scoop on a new, Model 3 motor-based in-tunnel drive unit at SEMA 2025.
ID 385029938 | Ai Data © Petro Kushnaryov | Dreamstime.com
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The companies said the deal will bring together their complementary engineering capabilities, creating R&D scale to deliver innovative RF solutions.
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Swappable EV batteries have been much talked about but rarely implemented in North America. However, China has made a big commitment to the technology and changing market dynamics...
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Different tolerances influence the precision of SMPS output voltage regulation. This article explains the different sources of inaccuracy and shows how the total tolerance range...

Multimedia

Here are out latest videos and podcasts. 

More of This Week's Articles

The Featured Articles above are just some of the content that's new this week on Electronic Design. Check out the rest here. 

Texas Instruments
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This first part of a two-part series explains how eFuses enable smarter protection against common short conditions in automotive electronics.
proteanTecs
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GenAI and ML workloads are causing a ramp up in silent data corruption. Multi-stage detection with on-chip, AI-based telemetry offers smarter fault prevention.
MIT
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This mechanically reconfigurable antenna can take on different dimensions and shapes for targeted performance shifts.
Segger
Segger 13-port USB hub
Why use a consumer product when you need industrial quality? Segger's new USB hub fits that bill.
Diamond Systems and NVIDIA
Diamond Systems Osbourne and NVIDIA AGX Orin
Diamond Systems' Osbourne carrier board hosts NVIDIA's AGX Orin AI module.
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The B3270xP series of ultra-small, MKP film capacitors from TDK are tailored for power-factor-correction stages in power supplies for consumer electronics.
Bourns Inc.
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The automotive-grade SDE0403AT and SRN5040TA-P Series offer higher current density and low-profile footprints for improved power efficiency and filtering performance.
ID 162798257 © Stononame | Dreamstime.com
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A miniaturized driver manages red, green, blue, and white LEDs for maximum impact with minimal system CPU burden.
ID 76252961 © Vladimir Timofeev | Dreamstime.com
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The company’s innovations, showcased at the OCP Global Summit, are designed to drive the latest AI-based data centers.

Editor's Choice: From the Electronic Design Archives

These articles were chosen by the editors at Electronic Design that complement the new articles above. They are included in our regular newsletters

With all the wireless design activity going on these days, one wonders just how many engineers are actually educated in wireless principles anymore.
Thermal management is critical for rugged-systems design, where SWaP-C (size, weight, power, and cost) constraints require innovative cooling strategies.
Jon Peddie Research’s AI report highlights AI trends, including the downturn in AI startups and a greater focus on edge AI.
This supercapacitor-based photovoltaic lighting system provides light at all times of the day and works for 15 years without any maintenance.
Digital multimeters are often the equipment of choice when measuring Li-ion cell voltage. However, DMMs draw current when connected to the electrode contacts and could negatively...

Editor's Picks from Other Websites

We hope you enjoy the articles on Electronic Design, but there's a lot going on and we can't cover everything. In this section, Electronic Design editors highlight articles they found this week that you might be interested in as well. 

Bill Wong's Picks

Will fusion funding make a difference? 

  • U.S. Nuclear Fusion Roadmap Requires Persistence, Partnerships @ Energy Tech - The DOE’s newly released Fusion Science and Technology (FS&T) Roadmap got its first public share at the U.S. Fusion Energy Enterprise Events last week in Washington, D.C. Unlike its nuclear cousin fission—in which atoms are split to release and control energy output—nuclear fusion combines two or more atomic nuclei to create a theoretically limitless reaction in energy output.
 

 

More Top Stories of the Week

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Check out the latest stories, videos and podcasts from the week of October 27, 2025.
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Check out the top stories from this week on Electronic Design

About the Author

Roger Engelke Jr.

Managing Editor - Electronic Design and Microwaves & RF

Roger manages the websites and print issues for Electronic Design and Microwaves &RF. 

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