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This FAQ introduces and explains the new eUSB2 and eUSB2V2 standards, targeted at inside-the-box connections within AI PCs and other edge AI applications.
Low Power Vision Processing for Physical AI
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Inside Electronics
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Check out the latest stories, videos, and podcasts from the week of May 18, 2026.
May 19, 2026
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Members Only
Download this eBook that brings results from our Salary Survey, which offers perspective on careers represented by different publications in our Design Engineering group.
May 15, 2026
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Sensors Converge 2026
What's new in sensors and AI at this year's conference.
May 6, 2026
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A rising number of advanced applications, from robotics to automotive, are implementing LiDAR technology to handle data gathering.
April 30, 2026

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Designing efficient and reliable power systems requires more than simply choosing the right architecture. Successful power topology design depends on how engineers execute critical...
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Manage thermal challenges in compact, power-dense electronics using multiphysics simulation. Learn to predict heat transfer, optimize cooling, reduce hotspots, and improve reliability...
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Learn how scalable system architecture helps reduce development challenges, improve testing efficiency, and accelerate time to market for new tech.
May 13, 2026
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Discover how solid-state relays for building automation are transforming modern control systems in this insightful infographic from Littelfuse. As a global leader in circuit protection...
May 12, 2026

Featured Media

Exploring GigaDevice GD32H7 & Wi-Fi 6 RISC-V
GigaDevice’s GD32VW553 general-purpose RISC-V microcontroller supports Wi-Fi 6.
May 7, 2026
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At APEC, Empower Semiconductor showed how its Crescendo vertical power delivery solution can help improve thermal management for GPUs and other hot-running AI chips.
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At CES, Texas Instruments said it sees wireless connectivity as a solution for the labyrinth of heavy copper wiring in EV battery packs.
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Universal Chiplet Interconnect Express & Design Verification
Cadence’s Verification IP (VIP), which supports UCIe, can be integrated into IP, SoC, and system levels.
April 27, 2026

Inside Electronics Podcast

Technology Advancements

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DC arc fault detection is undergoing a transformation thanks to edge AI, helping power systems spot dangerous faults faster, locally, and before they cause costly failures.
May 13, 2026
Institute of Materials Science of Seville
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A modified perovskite cell harvests both solar energy and raindrop-induced triboelectricity.
May 12, 2026
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Landing Zones Canada’s Eagle APDS uses a high-altitude balloon launch to extend military drone range, endurance, and payload delivery in GNSS-contested environments.
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EliteSiC technology enables faster charging, longer range, and stronger performance across NIO’s latest EV platforms.
The road to 900-V-powered electric vehicles is being paved by onsemi’s partnerships with NIO and Geely, exploiting EliteSiC technology to make it happen.
May 7, 2026

Products and Solutions

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The 120-, 160-, and 240-kW power-electronics systems from Hyundai Mobis will work with EVs ranging from small mobility solutions to high-performance vehicles.
May 15, 2026
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There are multiple ways to mitigate heat dissipation in a PCB.
May 15, 2026
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Danisense's latest high-precision DC and AC current clamp-on handles galvanically isolated measurements up to 500 A with a current measurement accuracy of ±0.1%.
May 14, 2026
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This edition of PowerBites explores a cavalcade of power innovations from the recent APEC event, looks at how California is taking the lead in making bidirectional EV charging...
May 13, 2026

Industry Insights

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This article dives deep into the engineering tradeoffs required to achieve side-channel-resilient PQC implementations on modern root-of-trust (RoT) devices that must meet high...
May 19, 2026
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There’s more than one way to use containers.
May 18, 2026
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MISRA C compliance succeeds when teams understand its safety purpose, apply it pragmatically, and build it into daily embedded-software development.
May 18, 2026
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Last year’s Salary Survey delivered some eye-opening results. We’ve got a synopsis of them from three publications in our Design Engineering group: Electronic Design, Microwaves...
May 15, 2026