APEC 2026

Stay on top of the technologies and trends in focus at APEC 2026 and hear from industry insiders on the state of the power electronics industry.
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March 9, 2026
2 min read
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Welcome to Electronic Design's coverage of APEC 2026. Here, you can find links to our latest articles, videos, and podcasts. Stop in regularly to see the latest coverage as it goes live, or sign up for the Power and Analog newsletter to get the latest stories sent right to your inbox. You can view the latest newsletters here.

If you or your company are attending the conference, you're welcome to send news or information about demos and in-person meeting opportunities with Electronic Design to Senior Editor James Morra. You can find contact information here.

Table of Contents

Featured

Infineon Technologies
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Infineon said its new coreless current sensor can handle higher frequencies than traditional Hall-based current sensors.
Lee Goldberg
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Here’s a sampler of the new developments editors James Morra and Lee Goldberg got to see during their visit to APEC 2026.
APEC has grown into one of the largest technical conferences in North America.
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The XDM700-1 from Infineon delivers 12-bit voltage and current monitoring for mission-critical compute and energy applications.
Dreamstime_Colicaranica_139754890 and EPC
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EPC’s evaluation kit for a three-phase inverter platform based on its Gen-7 EPC2366 eGaN power transistor streamlines motor drives in commercial, industrial, and consumer apps...
Lee Goldberg
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The company’s rugged, cool-running, industrial-grade 240-W LED driver put the spotlight on its integrated GaN devices and high-end packaging technologies.
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A new series of small, shielded power inductors from Bourns is designed to reduce EMI in tightly packed DC-DC converter circuits.
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pSemi introduced a single-chip, 4-stage, charge-pump-based buck converter for multi-mode USB battery-charging applications.
Infineon's new family of DC-DC converters aim to power the increasing number of non-core rails in server processors.
The new probe tip for Tektronix's series of isolated current probes enables direct current measurements from –40 to 125°C.
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Renesas’ reference design for a 500-W single-stage solar microinverter draws on the power of its latest 650-V bidirectional GaN switch devices.
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Featuring up to 1.5 MHz of bandwidth, the new 1,000-A RMS current probe from Teledyne LeCroy can handle high-power measurement in motor drives and inverters.
The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.
TDK Corp. (and Tony Vitolo/EndeavorB2B)
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Delve into the details of vertical power delivery and how it surmounts the limits of traditional lateral power when it comes to supporting secondary power rails.
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Parallel battery-management ICs provide new ways to stretch out the limited runtime of smart glasses and AR devices.

Multimedia

Here are the latest videos and podcasts related to power electronics and APEC 2026.

Inside Electronics
Electronic Design editors reveal what technologies and products stood out to them at the recent APEC 2026.
At APEC, Empower Semiconductor showed how its Crescendo vertical power delivery solution can help improve thermal management for GPUs and other hot-running AI chips.
At APEC 2026, TI's Kannan Soundarapandian discussed the shift to 800-V DC power architectures in the data center.
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Inside Electronics
Ferric is positioning its integrated voltage regulators as “power chiplets" primed for co-packaging with high-performance GPUs and other chips.
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Inside Electronics
Although many may think that silicon is nearing obsolescence in power electronics applications, there’s still a lot of life in the beast.

More Show Coverage

The features above are only part of the content that's new on Electronic Design. Check out the rest here.

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STMicroelectronics’ compact solution targets motor-control applications in domestic appliances and industrial drives.
The new buck converter from STMicroelectronics, which helps simplify power design, features 93% efficiency and a low BOM.
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Many of Alpha and Omega’s devices addressing AI-related power applications feature packaging with enhanced cooling features.
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Developed by EPFL, the transformers are integrated into Navitas’ GeneSiC 3,300- and 1,200-V SiC devices with the goal of helping the adoption of high-voltage DC AI data centers...
Rugged BZPACK mSIC power modules from Microchip meet HV H3TRB standards and deliver exceptional reliability.
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EPC claims its seventh-generation, 40-V power transistor delivers up to 3X better performance than equivalent silicon MOSFETs.
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
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TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including AI-class processors in its Versal family.
Bourns’ air coil inductors meet today’s high-frequency application demands for enhanced signal filtering, efficient energy transfer, and tight inductance tolerance.

More APEC Coverage from the Archives

These articles, selected by Electronic Design's editors, revisit coverage from past shows.

Texas Instruments
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eFuses integrate power switches, digital controllers, current sensing, and all of the other smarts for hot swapping in a single chip. For TI, they represent the future of circuit...

More Event Coverage on Electronic Design

Electronic Design's editors have been on the ground at several conferences and trade shows this year. Start exploring highlights from their coverage here.

William Wong | Santa Clara Convention Center
Santa Clara Convention Center
Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.
William Wong/EndeavorB2B
Las Vegas Convention Center
CES presented some interesting tech on the floor — and behind closed doors.

About the Author

James Morra
Email

James Morra

Senior Editor

James Morra is the senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.

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