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Synopsys' Abhijeet Chakraborty talks about chiplet trends, challenges, and solutions.
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Chiplet Summit System-Level Evaluation of Multi-Vendor Chiplets Pre-RTL
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Check out the breaking news, videos, and podcasts at this year's Embedded World conference.
March 10, 2026
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Check out the latest stories, videos, and podcasts from the week of Mar. 9, 2026.
March 10, 2026
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Stay on top of the technologies and trends in focus at APEC 2026 and hear from industry insiders on the state of the power electronics industry.
March 9, 2026
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Software-defined vehicles (SDVs) are built around real-time networking.
March 3, 2026

Learning Resources

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Discover how Capital VSTAR simplifies ECU software configuration and calibration, streamlining development, enhancing collaboration, and reducing time-to-market for AUTOSAR-based...
March 11, 2026
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Explore how software factories and Siemens Capital empower automakers to streamline development, enable agile innovation, and deliver smarter, safer, connected vehicles faster...
March 11, 2026
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See how Capital software streamlines E/E collaboration, increases innovation speed, and eliminates design silos-empowering you to deliver complex products faster without sacrificing...
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Discover how Air Source Heat Pumps are transforming HVAC design. This application brief highlights market opportunities, innovative solutions, and advanced technologies that accelerate...
March 5, 2026

Featured Media

Breaking the Date Movement Bottleneck Chiplets Summit Session
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Find out how to tie all of those chiplets together with multi-die coherent networks.
March 11, 2026
Software Guided Intelligence
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Delivering RISC-V development and IP for designers and developers.
March 10, 2026
Examining a Physical AI Chiplet Platform
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Mick Posner highlights Cadence’s chiplet platform to support physical AI development.
March 9, 2026
Chiplets Summit Award Session
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A rundown of the award winners at Chiplet Summit 2026.
March 7, 2026

Inside Electronics Podcast

Technology Advancements

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Using LnFP technology as an active material, OMI said it has developed a rapid ion transport cathode designed to handle charging at a 20C rate.
March 5, 2026
Driving Innovation in 3d IC Chiplet Summit
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Find out about design trends, challenges, and solutions around 3D ICs.
March 4, 2026
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Inside Electronics
Find out how to do AI processing of multiple video streams locally.
March 3, 2026
The Ohio State University
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There may be a fungus on your future bill of materials if mushroom-based memristors become a viable memory element.
March 2, 2026

Products and Solutions

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MediaTek’s Genio family expands with NPU-enhanced chips that can handle generative AI.
March 10, 2026
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A hybrid DC-DC converter topology boosts efficiency by combining a buck regulator and a charge pump. Is it the future of intermediate bus conversion?
March 9, 2026
Vertical Power: Tackling AI’s Power Demands from Beneath the Board
Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath server boards and AI accelerator cards.
March 6, 2026
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TI’s latest iso-amps are specifically designed for interfacing with current-sensing resistors.
March 6, 2026

Industry Insights

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Andy’s back from the 2026 Analog Aficionados meetup, held at DesignCon this year, and pieces together some history of the event as well as launching a downloadable annual calendar...
March 11, 2026
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Artificial intelligence is a logical progression in edge computing and automated testing. However, it’s important to understand how best to deploy AI in a system.
March 10, 2026
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UCIe 3.0 springs open the door to higher speeds, enhanced link reliability, and smarter system coordination for increasingly complex chiplet packaging needs.
March 10, 2026
EndeavorB2B, Lee Goldberg, and Hugmans Oasis
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Three of Electronic Design’s most colorful editors will be attending North America’s leading power conference and would love to meet you if you’re planning to attend APEC 2026...
March 9, 2026