Marvell’s Bravera SC6 NVMe controller is built with the company’s 6th-generation NANDEdge technology that features a low-density parity-check error correction engine.
As Physical AI moves from concept to reality, humanoid robots demand smarter, more efficient motor control. Join Infineon to see how advanced semiconductor technologies are enabling...
Learn how open standards drive interoperability and innovation in embedded computing. Explore key organizations like SGET, PICMG, and VITA, discover why interconnects are critical...
Sponsored by Texas Instruments: This article takes a deep dive into the latest power-supply developments for data centers and how advanced MCUs are implementing GaN semiconductors...
Optimize optical system performance with the right motion technologies. Learn how to select galvo scanners, DC motors, and piezo motors to improve speed, precision, and reliability...
As the cost of test rises with complexity of AI and other advanced devices, system-level test with integrated test cells is becoming a foundational approach.
The 2,200-V PowiGaN technology brings higher power density, greater efficiency, and safer and simpler system architectures to EVs, AI data centers, and photovoltaic and HVDC systems...
Pre-1945 steel can help suppress background radiation in rare-event detectors, but modern ultra-low-background metals and shielding strategies now provide practical alternatives...
As data centers become larger, denser, and more power-hungry, engineers are forced to rethink how they manage safety and maintenance — and how both factor into uptime.
DARPA’s experts chatted with Andy about Lift Challenge 1.0, providing design analyses and unique insights on the innovation process and what Lift Challenge 2.0, announced today...
DARPA just revealed a new sUAS (Drone) Lift Challenge to be held during summer 2028, where payload is now 220 lb. and the mission also doubles to 10 nm.
